Altium Designer 20 （中文版） 高速PCB设计实战攻略

定　　价：89 元

丛书名：卓越电子工程师高职高专教材

• 作者：林超文 等
• 出版时间：2020/3/1
• ISBN：9787121377815
• 出 版 社：电子工业出版社

适用读者:本书适合从事电路原理图与PCB设计相关的技术人员阅读，也可作为职业院校、技工院校及高等学校相关专业的教学参考书，尤其适合作为从事Altium Designer设计平台的PCB工程师的工具书。

• 中图法分类：TN410.2 
• 页码：364
• 版次：01
• 开本：16开
• 字数：582(单位：千字)

内容简介

本书依据Altium designer 20版本编写，详细介绍了利用Altium designer 20实现原理图与PCB设计的方法和技巧。本书结合设计实例，配合大量的示意图，以实用易懂的方式介绍印制电路板设计流程和电路综合设计的方法。本书注重实践和应用技巧的分享。全书共23章，主要内容包括：Altium Designer 20全新功能介绍、Altium Designer20软件概述及安装、系统参数及软件环境设置、工程文件管理、PCB封装库设计、PCB设计环境及快捷键设置、网表、PCB结构设计、布局设计、叠层阻抗设计、电源及地平面设计、规则设置、布线设计、PCB设计后处理、生产文件输出、光绘文件检查及CAM350应用、高级技巧应用、USB HUB设计、开关电源PCB设计、摄像头PCB设计、DDR3 T型和flyby结构的设计技巧和要点、DDR4设计概述及PCB设计要点、FPGA中原理图与PCB交互布线设计。本书在编写过程中力求精益求精、浅显易懂、工程实用性强，通过实例细致了讲述了具体的应用技巧及操作方法。

作者介绍

国内顶尖设计公司创始人兼首席技术官。EDA设计智汇馆（www.pcbwinner.com)首席讲师，为各大高校、电子科技企业进行CAE/高速硬件设计培训。创办EDA无忧学院580eda.net和EDA无忧人才网580eda.com，为企业提供精准猎头和硬件研发人才委培服务。同时在硬件互连设计领域有18年的管理经验，精通Cadence、Mentor、PADS、AD、HyperLynx等多种PCB设计与仿真工具。担任IPC中国PCB设计师理事会会员，推动IPC互连设计技术与标准在中国的普及；长期带领公司PCB设计团队攻关军工、航天、通信、工控、医疗、芯片等领域的高精尖设计与仿真项目。出版多本EDA书籍，系列书籍被业界称为“高速PCB设计宝典”。

目 录

目 录
第 1 章 Altium Designer 20 全新功能及性能改进·····················································（1）
1.1 Altium Designer 20 全新功能概述·············································································（1）
1.2 主题的切换·········································································································（1） 1.3 ActiveRoute 的重大改进·························································································（3） 1.3.1 扩展的 PCB ActiveRoute 面板 ········································································（3） 1.3.2 Route Guide 中的线到线间距 ·········································································（3） 1.3.3 Meander 控制·····························································································（4）
1.3.4 长度调整 ··································································································（4）
1.3.5 支持引脚交换 ····························································································（4）
1.3.6 其他改进 ··································································································（4）
1.4 焊盘或过孔连接方式的单独设置··············································································（5） 1.5 布线的改进·········································································································（6） 1.5.1 主动防止出现锐角及避免环路 ·······································································（6）
1.5.2 对差分对的走线优化 ···················································································（6）
1.5.3 布线跟随模式 ····························································································（7）
1.6 Draftsman 功能的改进 ···························································································（8） 1.7 无限制地增加机械层·····························································································（8） 1.8 微孔的设计·········································································································（9） 1.9 元器件的回溯功能································································································（9） 1.10 多板的 PCB 设计 ······························································································（10） 1.10.1 多板设计 2.0 的特点·················································································（10） 1.10.2 具体操作方法·························································································（10）
1.11 高级的叠层管理器 ····························································································（11） 1.12 本章小结 ········································································································（12） 第 2 章 Altium Designer 20 软件概述及安装 ··························································（13）
2.1 Altium Designer 的系统配置要求及安装···································································（13） 2.1.1 系统配置要求 ··························································································（13）
2.1.2 Altium Designer 20 的安装···········································································（14）
2.2 Altium Designer 20 的激活 ····················································································（17） 2.3 本章小结··········································································································（18） 第 3 章 Altium Designer 20 系统参数及软件环境设置 ············································（19）
3.1 常用系统参数设置······························································································（19） 3.1.1 关闭不必要的启动项 ·················································································（19）
3.1.2 中英文版本切换 ·······················································································（20）
3.1.3 高亮模式及交互选择模式设置 ·····································································（20）
3.1.4 文件关联开关 ··························································································（21）
3.1.5 软件的升级及插件的安装路径 ·····································································（22）
3.1.6 自动备份设置 ··························································································（22）
3.2 PCB 系统参数的设置 ··························································································（22） 3.2.1 “General”选项卡 ·····················································································（23）
3.2.2 “Display”选项卡······················································································（24）
3.2.3 “Board Insight Display”选项卡 ····································································（24）
3.2.4 “Board Insight Modes 选项卡········································································（25）
3.2.5 “Board Insight Color Overrides”选项卡 ··························································（25）
3.2.6 “DRC Violations Display”选项卡 ·································································（26）
3.2.7 “Interactive Routing”选项卡········································································（27）
3.2.8 “True Type Fonts”选项卡···········································································（28）
3.2.9 “Defaults”选项卡·····················································································（29）
3.2.10 “Layer Colors”选项卡··············································································（30）
3.3 系统参数的保存与调用························································································（30） 3.4 本章小结··········································································································（31） 第 4 章 工程文件管理································································································（32） 4.1 工程的组成·······································································································（32） 4.2 完整工程的创建·································································································（32） 4.2.1 新建工程 ································································································（33）
4.2.2 已存在工程文件的打开与路径查找 ·······························································（34）
4.2.3 新建或添加原理图元件库 ···········································································（35）
4.2.4 新建或添加原理图 ····················································································（36）
4.2.5 新建或添加封装库 ····················································································（36）
4.2.6 新建或添加 PCB·······················································································（37）
4.3 本章小结··········································································································（38） 第 5 章 PCB 封装库设计与管理 ·················································································（39） 5.1 PCB 元件封装的组成 ··························································································（39） 5.2 PCB 封装库编辑界面 ··························································································（39） 5.3 2D 标准封装创建 ·······························································································（40） 5.3.1 向导创建法 ·····························································································（41）
5.3.2 手动创建法 ·····························································································（45）
5.4 PCB 封装的检查与报告 ·······················································································（49） 5.5 从PCB 文件生成 PCB 库 ·····················································································（50） 5.6 PCB 封装的复制 ································································································（51） 5.7 3D 封装的创建 ··································································································（51） 5.8 集成库·············································································································（53） 5.8.1 集成库的组成及创建 ·················································································（53）
5.8.2 集成库的分离 ··························································································（55）
5.8.3 集成库的安装与移除 ·················································································（56）
5.9 本章小结··········································································································（57） 第 6 章 PCB 用户界面及快捷键运用 ··········································································（58） 6.1 PCB 设计工作界面介绍 ·······················································································（58） 6.1.1 PCB 设计交互界面····················································································（58）
6.1.2 PCB 对象编辑窗口····················································································（59）
6.1.3 PCB 设计常用面板····················································································（59）
6.1.4 PCB 设计工具栏·······················································································（61）
6.2 常用系统快捷键·································································································（63） 6.3 快捷键的自定义·································································································（64） 6.3.1 Ctrl+左键单击设置法·················································································（64）
6.3.2 菜单选项设置法 ·······················································································（64）
6.4 本章小结··········································································································（65） 第 7 章 网表·············································································································（66） 7.1 原理图封装完整性检查························································································（66） 7.1.1 封装的添加、删除与编辑 ···········································································（66）
7.1.2 库路径的全局指定 ····················································································（67）
7.2 网表及网表的生成······························································································（69） 7.2.1 网表······································································································（69）
7.2.2 网表的生成 ·····························································································（70）
7.3 网表的导入·······································································································（70） 7.4 本章小结··········································································································（71） 第 8 章 PCB 结构处理 ·······························································································（72） 8.1 板框定义··········································································································（72） 8.2 自定义绘制板框·································································································（74） 8.3 定位孔的放置····································································································（75） 8.4 本章小结··········································································································（76） 第 9 章 布局设计·······································································································（77） 9.1 布局的常用基本操作···························································································（77） 9.1.1 全局操作 ································································································（77）
9.1.2 选择······································································································（82）
9.1.3 移动······································································································（85）
9.1.4 对齐······································································································（86）
9.2 飞线的使用方法和技巧························································································（87） 9.2.1 显示 /隐藏整板飞线····················································································（87）
9.2.2 显示 /隐藏元件飞线····················································································（87）
9.2.3 显示 /隐藏网络飞线····················································································（87）
9.2.4 显示 /隐藏网络类的飞线··············································································（88）
9.3 选择过滤器·······································································································（89） 9.4 布局的工艺要求·································································································（90） 9.4.1 特殊器件的布局 ·······················································································（90）
9.4.2 通孔器件的间距要求 ·················································································（90）
9.4.3 压接器件的工艺要求 ·················································································（91）
9.4.4 PCB 辅助边与布局····················································································（92）
9.4.5 辅助边与母板的连接方式：V-CUT 和邮票孔···················································（92）
9.5 布局的基本顺序·································································································（93） 9.5.1 交互式布局 ·····························································································（93）
9.5.2 结构件的定位 ··························································································（95）
9.5.3 整板信号流向规划 ····················································································（98）
9.5.4 模块化布局 ·····························································································（98）
9.5.5 主要关键芯片布局规划 ·············································································（100）
9.6 布局的常规约束原则··························································································（101） 9.6.1 元件排列原则 ·························································································（101）
9.6.2 按照信号流向布局原则 ·············································································（102）
9.6.3 抑制EMC 干扰源 ····················································································（102）
9.6.4 抑制热干扰 ····························································································（102）
9.7 本章小结·········································································································（102） 第 10 章 高速多层板的叠层阻抗设计········································································（103） 10.1 PCB 板材及参数特性························································································（103） 10.1.1 覆铜板的定义及结构···············································································（103） 10.1.2 铜箔的定义及应用··················································································（103） 10.1.3 PCB 板材分类························································································（105） 10.1.4 半固化片的形成及特性············································································（106） 10.1.5 PCB 基材常见的性能指标·········································································（108）
10.2 阻抗计算（以一个八层板为例） ·········································································（110） 10.2.1 微带线阻抗计算·····················································································（110）
10.2.2 带状线阻抗计算·····················································································（112）
10.2.3 共面波导阻抗计算··················································································（113）
10.2.4 阻抗计算的几个注意事项·········································································（114）
10.3 高速多层板的叠层设计思路 ···············································································（115） 10.3.1 合理的层数···························································································（115）
10.3.2 VCC、GND 作为参考平面，两者的作用与区别·············································（117） 10.3.3 电源层、地层、信号层的相对位置·····························································（118）
10.3.4 基于SI/PI、EMC、DFM 的叠层原则 ··························································（121）
10.4 叠层阻抗设计实例讲解 ·····················································································（121） 10.4.1 四层板叠层阻抗设计实例·········································································（123） 10.4.2 六层板叠层阻抗设计实例·········································································（124）
10.4.3 假八层及如何避免假八层设计···································································（127） 10.4.4 八层板叠层阻抗设计实例·········································································（129）
10.5 Altium Designer 20 的叠层管理器介绍···································································（133） 10.6 本章小结 ·······································································································（135） 第 11 章 电源及地平面设计······················································································（136） 11.1 电源和地处理的基本原则 ··················································································（137） 11.1.1 载流能力······························································································（137）
11.1.2 电源通道和滤波·····················································································（138）
11.1.3 直流压降······························································································（140）
11.1.4 参考平面······························································································（141）
11.1.5 其他要求······························································································（142）
11.2 常规电源的种类及其设计方法 ············································································（143） 11.2.1 电源的种类···························································································（143）
11.2.2 POE 电源介绍及设计方法·········································································（143） 11.2.3 48V 电源介绍及设计方法·········································································（144）
11.2.4 开关电源的设计·····················································································（145）
11.2.5 线性电源的设计·····················································································（147）
11.3 Altium Designer 20 对电源与地平面的分割·····························································（147） 11.3.1 Altium Designer 20 的铺铜操作 ··································································（149） 11.3.2 Altium Designer 20 内电层的分割实现 ·························································（154）
11.4 本章小结 ·······································································································（154） 第 12 章 规则设置····································································································（155） 12.1 类与类的创建 ·································································································（155） 12.1.1 类的简介······························································································（155） 12.1.2 网络类的创建························································································（156） 12.1.3 差分类的创建························································································（158）
12.2 常用PCB 规则设置项目 ····················································································（160） 12.3 电气规则设置 ·································································································（161） 12.3.1 安全间距规则设置··················································································（161） 12.3.2 规则的使能和优先级设置·········································································（165） 12.3.3 短路规则设置························································································（166） 12.3.4 开路规则设置························································································（167）
12.4 线宽规则设置 ·································································································（167） 12.5 过孔规则设置 ·································································································（170） 12.6 阻焊规则设置 ·································································································（171） 12.7 铜皮规则设置 ·································································································（171） 12.7.1 负片铜皮连接规则设置············································································（171） 12.7.2 通孔焊盘隔离环宽度设置·········································································（173） 12.7.3 正片铜皮连接规划设置············································································（174）
12.9 DFM 可制造性规则设置····················································································（175） 12.9.1 孔壁与孔壁之间的距离设置······································································（175） 12.9.2 阻焊桥的宽度设置··················································································（175） 12.9.3 丝印与阻焊之间的距离设置······································································（176） 12.9.4 丝印与丝印之间的距离设置······································································（177）
12.10 区域规则设置································································································（177） 12.11 差分规则设置································································································（180） 12.12 规则的导入与导出··························································································（182） 12.13 本章小结······································································································（183） 第 13 章 布线设计····································································································（184） 13.1 网络及网络类的颜色管理 ··················································································（184） 13.2 层的管理 ·······································································································（186） 13.3 元素的显示与隐藏 ···························································································（187） 13.4 特殊粘贴法的使用 ···························································································（188） 13.5 布线的基本操作 ······························································································（189） 13.5.1 走线打孔与换层·····················································································（189） 13.5.2 布线过程中改变线宽···············································································（190） 13.5.3 走线角度切换························································································（190） 13.5.4 实时跟踪布线长度及布线保护带显示··························································（191） 13.5.5 布线模式选择························································································（192） 13.5.6 总线布线······························································································（193）
13.6 PCB 布线扇孔·································································································（194） 13.7 添加泪滴 ·······································································································（195） 13.8 蛇形走线 ·······································································································（196） 13.8.1 单端蛇形线···························································································（197） 13.8.2 差分蛇形线···························································································（198）
13.9 多种拓扑结构的等长处理 ··················································································（199） 13.9.1 点到点绕线···························································································（199） 13.9.2 Fly_by 结构等长处理···············································································（200） 13.9.3 T 形结构等长处理 ··················································································（201） 13.9.4 From-To 等长法 ·····················································································（202） 13.9.5 xSignals 等长法······················································································（203） 13.10 常见器件 Fanout 处理······················································································（205） 13.10.1 SOP/QFP 等密间距器件的 Fanout······························································（206） 13.10.2 分离器件（小电容）的 Fanout ·································································（207） 13.10.3 分离器件（排阻）的 Fanout ····································································（208） 13.10.4 分离器件（BGA 下小电容）的 Fanout ·······················································（209） 13.10.5 分离器件（Bulk 电容）的 Fanout······························································（209） 13.10.6 BGA 的 Fanout ·····················································································（210）
13.11 常见BGA 布线方法和技巧···············································································（211） 13.11.1 1.0mm pitch BGA 的布线方法和技巧 ·························································（211） 13.11.2 0.8mm pitch BGA 的布线方法和技巧 ·························································（212） 13.11.3 0.65mm pitch BGA 的布线方法和技巧························································（213） 13.11.4 0.5mm pitch BGA 的布线方法和技巧 ·························································（215） 13.11.5 0.4mm pitch BGA 的布线方法和技巧 ·························································（216） 13.12 布线的基本原则及思路····················································································（218） 13.12.1 布线的基本原则 ···················································································（218） 13.12.2 布线的基本顺序 ···················································································（218） 13.12.3 布线层面规划 ······················································································（219） 13.12.4 布线的基本思路 ···················································································（219）
13.13 本章小结······································································································（220） 第 14 章 PCB 设计后处理 ························································································（221） 14.1 调整丝印位号 ·································································································（221） 14.1.1 丝印位号调整的原则及常规推荐尺寸··························································（221） 14.1.2 丝印位号的调整方法···············································································（222）
14.2 距离测量 ·······································································································（223） 14.2.1 点到点距离的测量··················································································（223） 14.2.2 边缘间距的测量·····················································································（224）
14.3 尺寸标注 ·······································································································（226） 14.3.1 线性标注······························································································（226） 14.3.2 圆弧半径标注························································································（227）
14.4 输出光绘前需要检查的项目和流程 ······································································（228） 14.4.1 基于Check List 的检查 ············································································（228） 14.4.2 DRC 设置·····························································································（228） 14.4.3 电气性能检查设置··················································································（229） 14.4.4 布线检查设置························································································（230） 14.4.5 Stub 线头检查设置··················································································（231） 14.4.6 丝印上阻焊检查设置···············································································（231） 14.4.7 丝印与丝印交叉或重叠检查······································································（232） 14.4.8 元件高度检查设置··················································································（232） 14.4.9 元件间距检查设置··················································································（232）
14.5 PCB 生产工艺技术文件说明···············································································（233） 14.6 本章小结 ·······································································································（235） 第 15 章 生产文件输出·····························································································（236） 15.1 装配图 PDF 文件的输出 ····················································································（236） 15.2 生产文件的输出 ······························································································（240） 15.2.1 Gerber 文件的输出··················································································（240） 15.2.2 钻孔文件的输出·····················································································（243）
15.2.3 IPC 网表的输出······················································································（243） 15.2.4 贴片坐标文件的输出···············································································（243）
15.3 本章小结 ·······································································································（245） 第 16 章 光绘文件检查及 CAM350 常用操作···························································（246）
16.1 光绘文件的导入 ······························································································（246） 16.2 光绘层的排序 ·································································································（247） 16.3 各层电气属性的指定 ························································································（248） 16.4 IPC 网表对比，开短路检查················································································（249） 16.5 钻孔文件检查 ·································································································（251） 16.6 最小线宽检查 ·································································································（252） 16.7 最小线距检查 ·································································································（253） 16.8 综合DRC 检查································································································（253） 16.9 阻焊到线的检查 ······························································································（254） 16.10 阻焊到丝印的检查··························································································（255） 16.11 阻焊桥的检查································································································（255） 16.12 本章小结······································································································（256） 第 17 章 Altium Designer 20 高级设计技巧及其应用 ············································（257）
17.1 FPGA 引脚的调整····························································································（257） 17.1.1 FPGA 引脚调整的注意事项·······································································（257） 17.1.2 FPGA 引脚的调整技巧·············································································（257）
17.2 相同模块布局布线的方法 ··················································································（261） 17.3 孤铜移除的方法 ······························································································（263） 17.3.1 正片去孤铜···························································································（263） 17.3.2 负片去孤铜···························································································（264）
17.4 检查线间距时差分间距报错的处理方法 ································································（266） 17.5 PCB 快速挖槽·································································································（267） 17.5.1 放置钻孔······························································································（267） 17.5.2 放置板框层 Board Cutout··········································································（268）
17.6 插件的安装方法 ······························································································（268） 17.7 PCB 文件中的 Logo 添加···················································································（269） 17.8 3D 模型的导出································································································（272） 17.8.1 3D STEP 模型的输出···············································································（272） 17.8.2 3D PDF 的输出 ······················································································（273）
17.9 极坐标的应用 ·································································································（273） 17.10 本章小结······································································································（275） 第 18 章 入门案例：USB HUB·················································································（276） 18.1 基本技能 ·······································································································（276） 18.1.1 USB HUB 原理图设计 ·············································································（276） 18.1.2 USB HUB PCB 设计················································································（276）
18.2 基本知识 ·······································································································（276） 18.2.1 设置差分网络························································································（276） 18.2.2 设置差分对规则·····················································································（280） 18.2.3 差分对走线···························································································（283） 18.2.4 原理图与 PCB 交互布局···········································································（283）
18.3 USB 差分线设计原则························································································（284） 18.4 本章小结 ·······································································································（285） 第 19 章 入门案例：开关电源 PCB 设计···································································（286） 19.1 基本技能 ·······································································································（286） 19.1.1 绘制电路原理图·····················································································（286） 19.1.2 工作原理······························································································（286） 19.1.3 PCB 设计······························································································（289）
19.2 PCB 抗干扰设计······························································································（291） 19.2.1 抑制干扰源···························································································（292） 19.2.2 切断干扰传播路径··················································································（294） 19.2.3 提高敏感器件的抗干扰性能······································································（294）
19.3 本章小结 ·······································································································（295） 第 20 章 进阶案例：摄像头 PCB 设计 ······································································（296） 20.1 基本技能 ·······································································································（296） 20.1.1 IMX274 原理图设计················································································（296） 20.1.2 IMX274 PCB 设计 ··················································································（296）
20.2 基本知识 ·······································································································（296） 20.2.1 设置差分网络························································································（296） 20.2.2 设置差分对规则·····················································································（302） 20.2.3 差分对走线···························································································（304） 20.2.4 原理图与 PCB 交互布局···········································································（306）
20.3 差分线设计原则 ······························································································（307） 20.4 本章小结 ·······································································································（307） 第 21 章 DDR3 内存的相关知识及 PCB 设计方法·····················································（308） 21.1 DDR 内存的基础知识 ·······················································································（308） 21.1.1 存储器简介···························································································（308） 21.1.2 内存相关工作流程与参数介绍···································································（308） 21.1.3 内存容量的计算方法···············································································（312） 21.1.4 DDR、DDR2、DDR3 各项参数介绍及对比 ··················································（312）
21.2 DDR3 互连通路拓扑·························································································（313） 21.2.1 常见互连通路拓扑结构介绍及其种类··························································（313） 21.2.2 DDR3 T 形及 Fly_by 拓扑之应用分析··························································（315） 21.2.3 Write Leveling 功能与 Fly_by 拓扑······························································（317）
21.3 DDR3 信号说明及分组······················································································（318）
21.4 DDR3 四片 Fly_by 结构设计···············································································（320） 21.4.1 布局····································································································（320） 21.4.2 VDD、VREF 和 VTT 等电源处理·······························································（322） 21.4.3 Fly_by 结构的 Fanout 处理········································································（324） 21.4.4 数据线及地址线互连···············································································（325）
21.5 DDR3 两片 T 形结构设计 ··················································································（325） 21.5.1 两片DDR3 T 形结构布局·········································································（326）
21.5.2 T 形结构 Fanout 处理···············································································（326） 21.5.3 VTT 上拉端接电子处理 ···········································································（327）
21.6 数据线及地址线等长处理 ··················································································（328） 21.7 内存PCB 设计要点总结 ····················································································（328） 21.8 本章小结 ·······································································································（329） 第 22 章 DDR4 设计概述及 PCB 设计要点介绍 ························································（330） 22.1 DDR4 信号分组·······························································································（330） 22.2 DDR4 布局要求·······························································································（331） 22.3 DDR4 布线要求·······························································································（332） 22.4 DDR4 走线线宽和线间距···················································································（333） 22.5 DDR4 等长要求·······························································································（333） 22.6 DDR4 电源处理·······························································································（334） 22.7 本章小结 ·······································································································（336） 第 23 章 FPGA 中原理图与 PCB 交互布线设计·························································（337） 23.1 实现交互的准备工作 ························································································（337）
23.2 如何实现 FPGA 原理图与 PCB 交互设计·······························································（339） 23.2.1 交互设置······························································································（339） 23.2.2 实现交互操作························································································（342）
23.3 原理图与 PCB 一致 ··························································································（343） 23.4 本章小结 ·······································································································（345）